There is a good reason for companies in the semiconductor industry to be ecstatic about the future of their business. That is, according to the information released by the World Semiconductor Trade Statistics (WSTS), the global semiconductor market will reach USD 298 billion this year 2013. Figures from its forecasts also reveal that this industry will grow at its historical high the following year at 5.1% or about USD 313 billion and the positive trend is expected to continue in 2015 at 3.8% up, which is about USD 325 billion.
Just like with all other semiconductor industry segments, the figures above also mean a promising future for the semiconductor process technology manufacturers, including those who are into making innovations for more effective silicon wafer cleaning processes.
As of today, the kinds of silicon wafer cleaning processes/technologies being utilized in the industry can be classified into three types and these are the following:
Dry cleaning - a number of techniques involved in this particular silicon wafer cleaning technology such as Ozonated Chemistries also known as the UV-ozone clean and is recognized as environmentally friendly alternative to sulfuric acid; Dry Ice (CO2 based); Aerosols that relies on a momentum transfer mechanism; Vapor Phase; and the process called Laser Assisted method.
Wet process - just like the dry process, there are also several techniques used under the wet process and these include: Immersion (immerse cassette in chemical bath); the megasonic cleaning, which is a type of acoustic cleaning that uses vibrational scrubbing method in a non-contact mode; the Centrifugal Spray method, which involves spraying freshly blended chemicals and high purity water; and, Aqueous cleaning that uses at least 95% water in the process.
The alternative - this is a combination of dry and wet method.
Though the silicon wafer cleaning process has come a long way since the beginning of this industry, there is still a room for improvement, which opens a portal of opportunities to serve the semiconductor industry even better. Manufacturers will surely be able to come up with new silicon wafer cleaning technology innovations that can help the industry not only in hastening the cleaning processes but produce product output with way better quality in the most convenient and inexpensive ways.
Just like with all other semiconductor industry segments, the figures above also mean a promising future for the semiconductor process technology manufacturers, including those who are into making innovations for more effective silicon wafer cleaning processes.
As of today, the kinds of silicon wafer cleaning processes/technologies being utilized in the industry can be classified into three types and these are the following:
Dry cleaning - a number of techniques involved in this particular silicon wafer cleaning technology such as Ozonated Chemistries also known as the UV-ozone clean and is recognized as environmentally friendly alternative to sulfuric acid; Dry Ice (CO2 based); Aerosols that relies on a momentum transfer mechanism; Vapor Phase; and the process called Laser Assisted method.
Wet process - just like the dry process, there are also several techniques used under the wet process and these include: Immersion (immerse cassette in chemical bath); the megasonic cleaning, which is a type of acoustic cleaning that uses vibrational scrubbing method in a non-contact mode; the Centrifugal Spray method, which involves spraying freshly blended chemicals and high purity water; and, Aqueous cleaning that uses at least 95% water in the process.
The alternative - this is a combination of dry and wet method.
Though the silicon wafer cleaning process has come a long way since the beginning of this industry, there is still a room for improvement, which opens a portal of opportunities to serve the semiconductor industry even better. Manufacturers will surely be able to come up with new silicon wafer cleaning technology innovations that can help the industry not only in hastening the cleaning processes but produce product output with way better quality in the most convenient and inexpensive ways.
About the Author:
Roy Van Rivero has had several years of experience working in the high-tech industry before venturing online as a web content writer. He leverages his prior knowledge to write industry-related topics, including silicon wafer cleaning. He also manages a personal industry blog, which reflects the nature of his current works.